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  IEC 60749-4 : 2.0

  IEC 60749-4 : 2.0 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 4: DAMP HEAT, STEADY STATE, HIGHLY ACCELERATED STRESS TEST (HAST) International Electrotechnical Committee

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  IEC 60749-10 : 1.0

  IEC 60749-10 : 1.0 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 10: MECHANICAL SHOCK International Electrotechnical Committee

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  IEC TR 61282-5 : 1.0

  IEC TR 61282-5 : 1.0 FIBRE OPTIC COMMUNICATION SYSTEM DESIGN GUIDES - PART 5: ACCOMMODATION AND COMPENSATION OF DISPERSION International Electrotechnical Committee

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  IEC 60749-3 : 2.0

  IEC 60749-3 : 2.0 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 3: EXTERNAL VISUAL EXAMINATION International Electrotechnical Committee

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  IEC 60749-7 : 2.0

  IEC 60749-7 : 2.0 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 7: INTERNAL MOISTURE CONTENT MEASUREMENT AND THE ANALYSIS OF OTHER RESIDUAL GASES International Electrotechnical Committee

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  IEC 60870-6-802 : 3.0

  IEC 60870-6-802 : 3.0 TELECONTROL EQUIPMENT AND SYSTEMS - PART 6-802: TELECONTROL PROTOCOLS COMPATIBLE WITH ISO STANDARDS AND ITU-T RECOMMENDATIONS - TASE.2 OBJECT MODELS International Electrotechnical Committee

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  IEC 61000-4-13 : 1.2

  IEC 61000-4-13 : 1.2 ELECTROMAGNETIC COMPATIBILITY (EMC) - PART 4-13: TESTING AND MEASUREMENT TECHNIQUES - HARMONICS AND INTERHARMONICS INCLUDING MAINS SIGNALLING AT A.C. POWER PORT, LOW FREQUENCY IMMUNITY TESTS International Electrotechnical...

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  IEC 61190-1-1 : 1.0

  IEC 61190-1-1 : 1.0 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY International Electrotechnical Committee

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  IEC 61340-3-2 : 2.0

  IEC 61340-3-2 : 2.0 ELECTROSTATICS - PART 3-2: METHODS FOR SIMULATION OF ELECTROSTATIC EFFECTS - MACHINE MODEL (MM) ELECTROSTATIC DISCHARGE TEST WAVEFORMS International Electrotechnical Committee

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  IEC 61190-1-2 : 3.0

  IEC 61190-1-2 : 3.0 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY International Electrotechnical Committee

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