SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 4: DAMP HEAT, STEADY STATE, HIGHLY ACCELERATED STRESS TEST (HAST)
International Electrotechnical Committee
FOREWORD<br>1 Scope <br>2 Normative references <br>3 Terms and definitions <br>4 HAST test - General remarks <br>5 Test apparatus <br>6 Test conditions <br>7 Procedure <br>8 Failure criteria<br>9 Safety <br>10 Summary
Gives a highly accelerated temperature and humidity stress test (HAST) for the purpose of evaluating the reliability of non-hermetic packaged semiconductor devices in humid environments.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 47 |
| Supersedes |
|
