ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY
International Electrotechnical Committee
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Standardized description for products
5 Test methods
6 Requirements
7 Quality assurance provisions
8 Preparation for delivery
9 Additional information - Performance and shelf life
extension inspections
Annex A (normative) - Test report on solder paste
Annex B (informative) - Reflow condition and profile
Annex C (informative) - Typical comparison of particle size
distributions between laser diffraction method and
screen method
Bibliography
Defines general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 91 |
