IEC 60749-3 : 2.0
IEC 60749-3 : 2.0
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 3: EXTERNAL VISUAL EXAMINATION
International Electrotechnical Committee
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 3: EXTERNAL VISUAL EXAMINATION
International Electrotechnical Committee
FOREWORD<br>1 Scope<br>2 Normative references<br>3 Terms and definitions<br>4 Test apparatus<br>5 Procedure<br>6 Failure criteria<br>7 Summary<br>Annex A (informative) - External visual report<br> form/checklist (example only - not a<br> mandatory template)<br>Bibliography
Aims to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document.
Document Type | Standard |
Status | Current |
Publisher | International Electrotechnical Committee |
Committee | TC 47 |
Supersedes |
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