IEC 60749-3 : 2.0

IEC 60749-3 : 2.0

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 3: EXTERNAL VISUAL EXAMINATION

International Electrotechnical Committee

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Table of Contents

FOREWORD<br>1 Scope<br>2 Normative references<br>3 Terms and definitions<br>4 Test apparatus<br>5 Procedure<br>6 Failure criteria<br>7 Summary<br>Annex A (informative) - External visual report<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;form/checklist (example only - not a<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;mandatory template)<br>Bibliography

Abstract

Aims to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document.

General Product Information

Document Type Standard
Status Current
Publisher International Electrotechnical Committee
Committee TC 47
Supersedes
  • IEC PAS 62163 : 1.0

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