IEC 61163-2 : 1.0
IEC 61163-2 : 1.0
RELIABILITY STRESS SCREENING - ELECTRONIC COMPONENTS
International Electrotechnical Committee
Table of Contents
Contents<br>Foreword<br>Introduction<br>Clause<br>1. Scope<br>2. Normative references<br>3. Definitions<br>4. Procedure<br> 4.1 General<br> 4.2 Programme definition<br> 4.3 Establish contact between the two parties <br> involved<br> 4.4 Identify the possible flaws and failure modes<br> for each component<br> 4.5 Select stress types, stress levels and stress <br> sequence to be used in order to precipitate failures<br> 4.6 Determine the duration of the reliability stress <br> screening process<br> 4.7 Mathematically analyze initial test results<br> 4.8 Perform failure analysis<br> 4.9 Perform stress sequence on the components<br> 4.10 Determine approval or rejection criteria<br> 4.11 Develop closed-loop corrective action process<br> 4.12 Provide feedback to the component manufacturers<br> 4.13 Discontinue the reliability stress screening process<br>Figure 1 - Component reliability screening process (general flow <br>chart)<br>Figure 2 - Corrective action process<br>Annex A (informative) Examples of tools for identifying failure<br>mechanisms in electronic components<br>Annex B (informative) Data analysis<br>Annex C (informative) Examples of applications of reliability<br>stress screening processes
Abstract
Gives a guide on reliability stress screening techniques and procedures for electronic components. This standard is meant for the use of component manufacturers as a guideline, and component users as a guideline for negotiating with component manufacturers on stress screening requirements also subcontractors who give stress screening as a service.
General Product Information
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 56 |
