Printed electronics - Part 501-1: Quality assessment - Failure modes and mechanical testing - Flexible and/or bendable primary or secondary cells
International Electrotechnical Committee
This part of IEC 62899 specifies failure modes and mechanical stress test methods for the determination of reliability characteristics of bendable or flexible printed primary cells and secondary cells and batteries as defined in IEC 60050-482:2004, 482-01-01,IEC 60050-482:2004, 482-01-02, IEC 60050-482:2004, 482-01-03, IEC 60050-482:2004,482-01-04 and IEC 60050-482:2004, 482-01-05, respectively.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 119 |
