Full Description

This standard establishes the requirements and other considerations (thermal, electrical, electromechanical and mechanical) for the design of Single Chip Module (SCM-L), MCM or MCM-L assemblies. Key concepts include adhesive interconnection information, typical die attach materials, microvia material properties, relationships with DFM and DFE.

Product Details

Published: 05/01/1998 ANSI: ANSI Approved Number of Pages: 44File Size: 1 file , 590 KB Product Code(s): 2225(D)1