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IPC J-STD-027

IPC J-STD-027 Mechanical Outline Standard for Flip Chip or Chip Scale Configurations

standard by Association Connecting Electronics Industries, 02/01/2003

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Full Description

THis standard establishes mechanical outline requirements for devices supplied in flip chip or CHip Size Package (CSP) formats. including die surface, die terminals, and interconnection balls/bumps/lands to the next level.

Product Details

Published: 02/01/2003 Number of Pages: 20File Size: 1 file , 90 KB Product Code(s): J-027(D)1, J-027(D)1

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