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IPC 7525B

IPC 7525B Stencil Design Guidelines

standard by Association Connecting Electronics Industries, 10/01/2011

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This document provides guidelines for the design and fabrication of stencils for solder paste and surface mount adhesive with discussion on through-hole and mixed technology. This includes differences for tin lead and lead-free solder paste, overprint, two-print and step stencil designs.

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Published: 10/01/2011 Number of Pages: 36File Size: 1 file , 2.1 MB

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