CONNECTORS WITH ASSESSED QUALITY, FOR USE IN D.C., LOW-FREQUENCY ANALOGUE AND IN DIGITAL HIGH-SPEED DATA APPLICATIONS - PRINTED BOARD CONNECTORS - BLANK DETAIL SPECIFICATION
International Electrotechnical Committee
INTRODUCTION
1 General data
1.1 Recommended method of mounting
1.1.1 Number of contacts or contact cavities
1.2 Ratings and characteristics
1.3 Normative references
1.4 Marking
1.5 IEC type designation
1.6 Ordering information
2 Technical information
2.1 Definitions
2.2 Survey of styles and variants
2.3 Information on application
2.3.1 Complete connectors (pairs)
2.3.2 Fixed board connectors
2.3.3 Free board connectors
2.3.4 Accessories
2.3.4.1 Special contacts
2.3.4.2 Coding devices
2.3.4.3 Mounting devices
2.3.5 Shielding/grounding
2.3.6 basic type of terminations
2.4 Contact arrangements
3 Dimensional information
3.1 General
3.2 Isometric view and common features
3.2.1 Common features
3.2.2 Reference system
3.2.3 Height dimensions
3.2.4 Width dimensions
3.2.5 Depth dimensions
3.3 Engagement (mating) information
3.3.1 Electrical engagement length
3.3.1.1 Contact levels and sequencing
3.3.2 Perpendicular to the engaging (mating)
direction
3.3.3 Inclination
3.4 Fixed board connectors
3.4.1 Dimensions
3.4.2 Terminations
3.5 Free board connectors
3.5.1 Dimensions
3.5.2 Terminations
3.6 Accessories
3.7 Mounting information for fixed board connectors
3.7.1 Hole pattern on printed boards
3.7.2 Mounting on panels
3.8 Mounting information for free board connectors
3.9 Gauges
3.9.1 Sizing gauges and retention force gauges
3.9.2 Mechanical operation, engaging/separating
force, insertion/withdrawal force gauges
3.9.3 Probes
3.9.4 Contact resistance gauge
3.9.5 Test panel (for voltage proof test)
4 Characteristics
4.1 Climatic category
4.2 Electrical
4.2.1 Creepage and clearance distances
4.2.2 Voltage proof
4.2.3 Current-carrying capacity
4.2.4 Contact resistance
4.2.5 Insulation resistance
4.3 Mechanical
4.3.1 Mechanical operation
4.3.2 Engaging and separating forces (or
insertion and withdrawal forces)
4.3.3 Contact retention in insert
4.3.4 Polarizing method
5 Test schedule
5.1 General
5.1.1 Arrangement for contact resistance
measurements
5.1.2 Arrangement for dynamic stress tests
5.1.3 Arrangement for testing static load, axial
5.1.4 Wiring of specimens
5.2 Test schedules
5.2.1 Basic test schedule
5.2.2 Full test schedule
5.2.2.1 Test group P - Preliminary
5.2.2.2 Test group AP - Dynamic/climatic
5.2.2.3 Test group BP - Mechanical
endurance
5.2.2.4 Test group CP - Moisture
5.2.2.5 Test group DP - Electrical test
5.2.2.6 Test group EP - Mechanical
resistivity
5.2.2.7 Test group FP - Chemical
resistivity
5.2.2.8 Test group GP - Connections
5.2.2.9 Test group HP - Additional
6 Quality assessment procedures
6.1 Qualification approval testing
6.1.1 Method 1
6.1.2 Method 2
6.2 Quality conformance inspection
6.2.1 Lot-by-lot tests
6.2.2 Periodic tests
6.3 Delayed delivery, re-inspection
Annexes
A Requirements for application to mechanical structures
B New tests and additional test phases
ZA (normative) Normative references to international publications
with their corresponding European publications
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | SC 48B |
