IEC 61709 : 3.0
IEC 61709 : 3.0
ELECTRIC COMPONENTS - RELIABILITY - REFERENCE CONDITIONS FOR FAILURE RATES AND STRESS MODELS FOR CONVERSION
International Electrotechnical Committee
Table of Contents
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and symbols
4 Context and conditions
5 Generic reference conditions and stress models
6 Integrated semiconductor circuits
7 Discrete semiconductors
8 Optoelectronic components
9 Capacitors
10 Resistors and resistor networks
11 Inductors, transformers and coils
12 Microwave devices
13 Other passive components
14 Electrical connections
15 Connectors and sockets
16 Relays
17 Switches and push-buttons
18 Signal and pilot lamps
19 Printed circuit boards (PCB)
20 Hybrid circuits
Annex A (normative) - Failure modes of components
Annex B (informative) - Thermal model for
semiconductors
Annex C (informative) - Failure rate prediction
Annex D (informative) - Considerations on mission
profile
Annex E (informative) - Useful life models
Annex F (informative) - Physics of failure
Annex G (informative) - Considerations for the design
of a data base on failure rates
Annex H (informative) - Potential sources of failure
rate data and methods of selection
Annex I (informative) - Overview of component
classification
Annex J (informative) - Presentation of component
reliability data
Annex K (informative) - Examples
Bibliography
Abstract
Provides guidance on the use of failure rate data for reliability prediction of electric components used in equipment.
General Product Information
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 56 |
