PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES
International Electrotechnical Committee
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
5 Through-hole mounting of components
6 Acceptance requirements
7 Rework of unsatisfactory solder connections
Annex A (normative) - Placement requirements for
through-hole mount devices
Bibliography
Gives requirements for lead and hole solder assemblies.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 91 |
