SEMICONDUCTOR DEVICES - INTEGRATED CIRCUITS - PART 11: SECTIONAL SPECIFICATION FOR SEMICONDUCTOR INTEGRATED CIRCUITS EXCLUDING HYBRID CIRCUITS
International Electrotechnical Committee
FOREWORD<br>PREFACE<br>Clause<br>1 Scope<br>2 General<br> 2.1 Related documents<br> 2.2 Recommended values of temperatures<br> 2.3 Recommended values of voltages<br> 2.4 Definitions related to manufacturing operations<br>3 Subcontracting<br>4 Primary stage of manufacture<br> 4.1 Bipolar devices<br> 4.2 Unipolar devices<br>5 Quality assessment procedures<br> 5.1 Qualification approval procedures<br> 5.2 Capability approval procedures<br>6 Structural similarity procedures<br> 6.1 General rules<br> 6.2 Test dependent criteria for structural similarity <br> - Table I<br>7 Groups and sub-groups<br> Table II - Group A: Lot by lot<br> Table III - Group B: Lot by lot<br> Table IV - Group C: Periodic tests<br> Table V - Group D<br>8 Screening<br> Table VI - Screening<br>9 Sampling requirements<br> Table VII - Sampling requirements for Group A tests<br> Table VIII - Sampling requirements for Group B, C<br> and D tests in which LTPD shall be used<br>10 Terminal identification<br>11 Additional information (under consideration)<br>12 Test and measurement procedures<br> 12.1 Electrical measuring methods<br> 12.2 Mechanical and climatic test methods<br> 12.3 Electrical endurance tests<br> 12.4 Accelerated test procedures<br> 12.5 Correlated measurements<br>APPENDIX A - Guidance and format for drafting blank<br> detail specifications
Pertains to encapsulated semiconductor integrated circuits, including multi-chip integrated circuits, but excluding hybrid circuits.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | SC 47A |
| Supersedes |
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