TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS)
International Electrotechnical Committee
FOREWORD<br>INTRODUCTION<br>1 Scope and object<br>2 Normative references<br>3 Accuracy, precision and resolution<br>4 Catalogue of approved test methods <br>5 P: Preparation/conditioning test methods<br>6 V: Visual test methods <br>7 D: Dimensional test methods<br>8 C: Chemical test methods <br>9 M: Mechanical test methods<br>10 E: Electrical test methods <br>11 N: Environmental test methods <br>12 X: Miscellaneous test methods<br>Annex A (informative) Worked examples
Specifies test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 91 |
