MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 4: CODING SYSTEM AND CLASSIFICATION INTO FORMS OF PACKAGE OUTLINES FOR SEMICONDUCTOR DEVICE PACKAGES
International Electrotechnical Committee
FOREWORD
1 Scope
2 Coding system of package outlines for
semiconductor devices
3 Classification into forms of package
outlines for semiconductor devices
4 Coding system for semiconductor-device
packages
5 Coding system of package-outline styles
Annex A (informative) - Examples of descriptive
coding system application
Annex B (informative) - Derivation and application
of the descriptive coding system - Common
package names
Annex C (informative) - Terminology of semiconductor
package outlines
Defines a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 47 |
