MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF DISCRETE DEVICES
International Electrotechnical Committee
FOREWORD<br>1 Scope <br>2 Normative references <br>3 Terms and definitions <br>4 General rules for all drawings <br>5 Additional rules <br>6 Inter-conversion of inch and millimetre dimensions and<br> rules for rounding off<br>7 Rules for coding <br>Annex A (informative) - Reference letter symbols<br>Annex B (informative) - Rules to specify the dimensions and<br> positions of terminals on a base drawing<br>Annex C (normative) - General philosophy of flat base devices <br>Annex D (normative) - Special rules for SMD-packages<br>Annex E (informative) - Examples of semiconductor device drawings<br>Annex F (informative) - Former rules for rounding off<br>Annex G (informative) - Former rules for coding<br>Bibliography
Gives guidelines on the preparation of outline drawings of discrete devices, including discrete surface-mounted semiconductor devices with lead count less than 8.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 47 |
