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IEC 60191-6-3 : 1.0

IEC 60191-6-3 : 1.0

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-3: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF QUAD FLAT PACKS (QFP)

International Electrotechnical Committee

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Table of Contents

FOREWORD
1 Scope
2 Normative references
3 Definitions
4 Measuring methods

Abstract

A method is stipulated for quad flat packs (QFP) measuring dimensions which are classified into Form E.

General Product Information

Document Type Standard
Status Current
Publisher International Electrotechnical Committee
Committee TC 47

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