MATERIALS FOR INTERCONNECTION STRUCTURES - PART 5: SECTIONAL SPECIFICATION SET FOR CONDUCTIVE FOILS AND FILMS WITH AND WITHOUT COATINGS - SECTION 1: COPPER FOILS (FOR THE MANUFACTURE OF COPPER-CLAD BASE MATERIALS)
International Electrotechnical Committee
FOREWORD
Clause
1. Scope
2. Normative reference
3. Designation
3.1 Types of copper foil
3.2 Types of surface profile
3.3 Bond enhancing treatment and passivation
3.4 Complete designation
4. Mass per unit area and thickness
5. Copper purity
6. Electrical properties
7. Tensile properties
8. Peel strength
9. Surface finish
9.1 Smooth side (shiny side)
9.2 Rough side (treatment side)
10. Dimensions and tolerances
10.1 Copper foil supplied in rolls
10.2 Copper foil supplied in sheets or cut panels
11. Packaging and marking
11.1 Copper foil supplied in rolls
11.2 Copper foil supplied in sheets or cut panels
11.3 Marking of packages
Annexes
A Sampling and test methods
B Bibliography
Gives requirements for properties of copper foil meant for use in the manufacture of copper-clad laminated sheets and of copper-clad flexible materials, used in the manufacture of printed boards. This applies to copper foil supplied in rolls, sheets or cut panels.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 52 |
