PRINTED BOARDS - PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS - SECTIONAL SPECIFICATION
International Electrotechnical Committee
Foreword<br>Introduction<br>1 Scope<br>2 Normative references<br>3 General<br>4 Capability approval and maintenance of capability<br> approval <br>5 Test specimens<br>6 Test sequence<br>7 Quality assessment<br>8 Customer detail specification (CDS) data<br>9 Characteristics of printed boards<br>10 Capability test programme<br>11 Quality conformance inspection<br>12 Test specimens<br>Figures<br>1 Resin smear at interface<br>2 Circumferential defects<br>3 Conductor pattern defects<br>4 Minimum annular width (W1) of external land<br>5 Minimum annular width (W2) of internal land<br>6 Hole break-out<br>7 Examples of soldered holes<br>Annexes <br>A Acronyms related to IECQ and their explanations<br>B Conversion table<br>C Bibliography
Applicable to rigid multilayer printed boards irrespective of their method of manufacture. It is the basis on which agreements between manufacturer and user are to be made. Establishes uniform requirements, specifies the characteristics to be assessed and the test methods to be used for quality conformance.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 52 |
