MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-6: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR FINE PITCH LAND GRID ARRAY (FLGA)
International Electrotechnical Committee
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Definitions
3.1 flanged type
3.2 type of real chip size
3.3 FLGA
3.4 material designation
3.4.1 plastic type (P-FLGA)
3.4.2 ceramic type (C-FLGA)
Gives common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | SC 47D |
