SEMICONDUCTOR DEVICES - INTEGRATED CIRCUITS - BLANK DETAIL SPECIFICATION FOR FILM INTEGRATED CIRCUITS AND HYBRID FILM INTEGRATED CIRCUITS ON THE BASIS OF QUALIFICATION APPROVAL PROCEDURES
International Electrotechnical Committee
INTRODUCTION
Clause
1. Characteristics and conditions of use
2. Recommended methods of mounting
3. Marking
4. Ordering information
5. Certified records of released lots
6. Additional information
7. Additional or increased severities or requirements
to those specified in the generic and/or sectional
specification
8. Inspection requirements (see tables 2 and 3 or 4
and 5)
9. Supplement - Tables of method B
Tables
1. Where a range of circuits
2. Method A - Groups A and B - Lot-by-Lot
3a. Method A - Group C - Periodic tests
3b. Method A - Group D - Periodic tests
4a. Method B - Group A - Lot-by-Lot
4b. Method B - Group B - Lot-by-Lot
5a. Method B - Group C - Periodic tests
5b. Method B - Group D - Periodic tests
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 47 |
| Supersedes |
|
