SEMICONDUCTOR DEVICES - INTEGRATED CIRCUITS - BLANK DETAIL SPECIFICATION FOR FILM INTEGRATED CIRCUITS AND HYBRID FILM INTEGRATED CIRCUITS ON THE BASIS OF THE CAPABILITY APPROVAL PROCEDURES
International Electrotechnical Committee
1 Characteristics and conditions of use
2 Recommended methods of mounting
3 Marking
4 Ordering information
5 Certified records of released lots
6 Additional information
7 Additional or increased severities or requirements
to those specified in the generic and/or sectional
specification
8 Inspection requirements (see tables 2 and 3 or 4
and 5)
9 Supplement - Tables of method B
Tables
1 Where a range of circuits
2 Method A - Groups A and B - Lot-by-lot
3a Method A - Group C - Periodic tests
3b Method A - Group D - Periodic tests
4a Method B - Group A - Lot-by-lot
4b Method B - Group B - Lot-by-lot
5a Method B - Group C - Periodic tests
5b Method B - Group D - Periodic tests
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 47A |
| Supersedes |
|
