SEMICONDUCTOR DEVICES - INTEGRATED CIRCUITS - GENERIC SPECIFICATIONS FOR FILM INTEGRATED CIRCUITS AND HYBRID FILM INTEGRATED CIRCUITS - REQUIREMENTS FOR INTERNAL VISUAL EXAMINATION
International Electrotechnical Committee
FOREWORD
Clause
1 Scope and object
1.1 Purpose
1.2 Sequence of inspections
1.3 Inspection apparatus
1.4 Inspection environment
1.5 Magnification
1.6 Definitions
1.7 Interpretations
1.8 Alternative test methods
2 Substrate and processes
2.1 Substrate
2.2 Processes
3 Assembly - Mechanical attachment and electrical connection
of parts to the substrate
3.1 Added components
3.2 Assembly method
4 Assembly - Mechanical attachment and electrical connection
of substrate to package
4.1 General
4.2 Soldering and organic adhesive
5 Wire interconnections
5.1 General
5.2 Gold ball and wedge bonds
5.3 Gold ball bonds
5.4 Tail-less (crescent) bonds
5.5 Wedge bonds
5.6 Compound bonds
5.7 Beam lead bonds
5.8 Criteria for wires
6 Package conditions
7 Foreign material
Figures
It is the intention of these examinations to check the internal materials, construction and workmanship of film and hybrid integrated circuits.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | SC 47A |
| Supersedes |
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