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IEC 60191-6-8 : 1.0

IEC 60191-6-8 : 1.0

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-8: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR GLASS SEALED CERAMIC QUAD FLATPACK (G-QFP)

International Electrotechnical Committee

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Table of Contents

FOREWORD<br>1 Scope and object<br>2 Normative references<br>3 Definitions<br>4 Numbering of the pins<br>Tables

Abstract

Provides the common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flat-pack (hereinafter called G-QFP). The object of this design guide is to standardize outlines and obtain inter-changeability of G-QFP.

General Product Information

Document Type Standard
Status Current
Publisher International Electrotechnical Committee
Committee SC 47D

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