IEC 61188-1-1 : 1.0

Table of Contents

FOREWORD<br>INTRODUCTION<br>1 Scope<br>2 Normative reference<br>3 Basic requirements<br>&nbsp;&nbsp;&nbsp;&nbsp;3.1 Design<br>&nbsp;&nbsp;&nbsp;&nbsp;3.2 Rigid board manufacture<br>&nbsp;&nbsp;&nbsp;&nbsp;3.3 Assembly<br>&nbsp;&nbsp;&nbsp;&nbsp;3.4 Use<br>4 Deviations from flatness - rigid copper-clad base<br>&nbsp;&nbsp;&nbsp;&nbsp;material<br>&nbsp;&nbsp;&nbsp;&nbsp;4.1 Causes<br>&nbsp;&nbsp;&nbsp;&nbsp;4.2 Prevention and correction<br>&nbsp;&nbsp;&nbsp;&nbsp;4.3 Test methods and requirements<br>5 Deviations from flatness - Unassembled rigid <br>&nbsp;&nbsp;&nbsp;&nbsp;printed boards<br>&nbsp;&nbsp;&nbsp;&nbsp;5.1 Causes<br>&nbsp;&nbsp;&nbsp;&nbsp;5.2 Prevention<br>&nbsp;&nbsp;&nbsp;&nbsp;5.3 Rectification<br>&nbsp;&nbsp;&nbsp;&nbsp;5.4 Requirements for flatness<br>&nbsp;&nbsp;&nbsp;&nbsp;5.5 Measurement methods<br>6 Deviations from flatness - Rigid printed board<br>&nbsp;&nbsp;&nbsp;&nbsp;assemblies<br>&nbsp;&nbsp;&nbsp;&nbsp;6.1 Causes<br>&nbsp;&nbsp;&nbsp;&nbsp;6.2 Prevention<br>&nbsp;&nbsp;&nbsp;&nbsp;6.3 Correction<br>7 Problems associated with placement of surface-mounted<br>&nbsp;&nbsp;&nbsp;&nbsp;components<br>&nbsp;&nbsp;&nbsp;&nbsp;7.1 Placement of components (assembly)<br>&nbsp;&nbsp;&nbsp;&nbsp;7.2 Requirements for 'pick-and-place' machines<br>8 Deviations from flatness in service<br>9 Prevention summary<br>10 Corrective action summary

Abstract

Covers factors controlling the flatness of rigid printed board with assemblies. Acquaints the designer, manufacturer, assembler and user of rigid printed boards and assemblies with factors which affect flatness. Also includes advice regarding design, base material, unassembled printed boards and printed board assemblies.

General Product Information

Published
Document Type	Standard
Status	Current
Publisher	International Electrotechnical Committee
Pages
ISBN
Committee	TC 52