PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - GENERIC REQUIREMENTS - CONTROLLED IMPEDANCE
International Electrotechnical Committee
1. Scope<br>2. Normative references<br>3. Engineering design overview<br> 3.1 Device selection<br> 3.2 Interconnection<br> 3.3 Printed board and printed board assemblies<br> 3.4 Performance requirements<br> 3.5 Power distribution<br>4. Design of controlled impedance circuits<br> 4.1 Configurations<br> 4.2 Equations<br> 4.3 Controlled impedance design rules<br> 4.4 Cross-talk rules<br> 4.5 Coupon design rules<br> 4.6 Decoupling/capacitor rules<br>5. Design for manufacturing<br> 5.1 Process rules in CAD<br> 5.2 Design complexity and correlation to cost<br>6. Data description<br> 6.1 Details of construction<br> 6.2 Isolation of data by net class (noise, timing, <br> capacitance and impedance)<br> 6.3 Electrical performance<br>7. Material<br> 7.1 Resin systems<br> 7.2 Reinforcements<br> 7.3 Prepregs, bonding layers and adhesives<br> 7.4 Frequency dependence<br>8. Fabrication<br> 8.1 General<br> 8.2 Preproduction processes<br> 8.3 Production processes<br> 8.4 Impact of defects at high frequencies<br> 8.5 Data description<br>9. Time domain reflectrometry (TDR) testing<br> 9.1 Rationale<br>Annex A - Units, symbols, and terminology
Aim is to transfer a signal from one device to one or more other devices through a conductor. High-speed designs are designs in which the interconnecting properties affect circuit performance and need unique considerations.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 52 |
