IEC 61189-2 : 2.0

TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2: TEST METHODS FOR MATERIALS FOR INTERCONNECTION STRUCTURES

International Electrotechnical Committee

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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Accuracy, precision and resolution
   3.1 Accuracy
   3.2 Precision
   3.3 Resolution
   3.4 Report
   3.5 Student's 't' distribution
   3.6 Suggested uncertainty limits
4 Catalogue of approved test methods
5 P: Preparation/conditioning test methods
   5.1 Test 2P01: Dry heat (under consideration)
   5.2 Test 2P02: Solder float stress (under consideration)
6 V: Visual test methods
7 D: Dimensional test methods
   7.1 Test 2D01: Thickness of base materials and rigid
         boards
8 C: Chemical test methods
   8.1 Test 2C01: Resistance to sodium hydroxide of base
         materials
   8.2 Test 2C02: Gel time of epoxy based prepreg materials
   8.3 Test 2C03: Resin content of prepreg materials by
         treated weight
   8.4 Test 2C04: Volatile content of prepreg materials
   8.5 Test 2C05: Blistering during heat shock
   8.6 Test 2C06: Flammability, vertical burning test
         for rigid materials
   8.7 Test 2C07: Flammability; horizontal burning test
         for rigid materials
   8.8 Test 2C08: Flammability, flex material
   8.9 Test 2C09: Melting viscosity of prepreg materials
   8.10 Test 2C10: Resin content of prepreg materials by
         sublimation
   8.11 Test 2C11: UV blocking characteristics of laminates
   8.12 Test 2C12: Total halogen content in base materials
9 M: Mechanical test methods
   9.1 Test 2M01: Test method for bow and twist
   9.2 Test 2M02: Bow/twist after etching and heating
   9.3 Test 2M03: Cure factor of base materials by
         differential scanning calorimetry (DSC) or
         thermomechanical analysis (TMA)
   9.4 Test 2M04: Twist after heating (under consideration)
   9.5 Test 2M05: Pull-off strength
   9.6 Test 2M06: Peel strength after exposure to solvent
         vapour
   9.7 Test 2M07: Peel strength after immersion in solvent
   9.8 Test 2M08: Flexural strength (under consideration)
   9.9 Test 2M09: Resin flow of prepreg material
   9.10 Test 2M10: Glass transition temperature of base
         materials by differential scanning calorimetry (DSC)
   9.11 Test 2M11: Glass transition temperature of base
         materials by thermomechanical analysis (TMA)
   9.12 Test 2M12: Surface waviness
   9.13 Test 2M13: Peel strength as received
   9.14 Test 2M14: Peel strength after heat shock
   9.15 Test 2M15: Peel strength after dry heat
   9.16 Test 2M16: Peel strength after simulated plating
   9.17 Test 2M17: Peel strength at high temperature
   9.18 Test 2M18: Surface quality (under consideration)
   9.19 Test 2M19: Punching (under consideration)
   9.20 Test 2M20: Flexural strength
   9.21 Test 2M21: Rolling fatigue of flexible base materials
   9.22 Test 2M22: Weight of foil after lamination
   9.23 Test method 2M23: Rectangularity of cut panels
   9.24 Test 2M24: Coefficient of thermal expansion (under
         consideration)
   9.25 Test 2M25: Time to delamination by thermomechanical
         analysis (TMA)
   9.26 Test 2M26: Scaled flow test for prepreg materials
   9.27 Test 2M27: The resin flow properties of coverlay
         films, bonding films and adhesive cast films used
         in the fabrication of flexible printed boards
10 Electrical test methods
   10.1 Test 2E01: Surface tracking, moisture condition
         (under consideration)
   10.2 Test 10.2 2E02: Dielectric breakdown of base
         materials parallel to laminations
   10.3 Test 2E03: Surface resistance after damp heat,
         steady state
   10.4 Test 2E04: Volume resistivity and surface resistivity
   10.5 Test 2E05: Permittivity and dielectric dissipation
         (under consideration)
   10.6 Test 2E06: Volume and surface resistivity, 3
         electrodes (under consideration)
   10.7 Test 2E07: Surface and volume resistivity, elevated
         temperature (under consideration)
   10.8 Test 2E08: Surface corrosion
   10.9 Test 2E09: Comparative tracking index (CTI)
   10.10 Test 2E10: Permittivity and dissipation factor
         (under consideration)
   10.11 Test 2E11: Electric strength (under consideration)
   10.12 Test 2E12: Resistance of foil (under consideration)
   10.13 Test 2E13: Corrosion at edge (under consideration)
   10.14 Test 2E14: Arc resistance
   10.15 Test 2E15: Dielectric break-down (under consideration)
   10.16 Test 2E16: Contact resistance of printed circuit
         keypad cont (under consideration)
   10.17 Test 2E17: Insulation resistance of printed board
         materials
   10.18 Test 2E18: Fungus resistance of printed board
         materials
11 N: Environmental test methods
   11.1 Test 2N01: Pressure cooker test (under consideration)
   11.2 Test 2N02: Water absorption
12 X: Miscellaneous test methods
   12.1 Test 2X02: Dimensional stability of thin laminates
Annex A (informative) Worked examples
Annex B (informative) Conversion table
Annex C (informative) Laboratory pro forma (form)
Annex D (informative) Laboratory pro forma

Abstract

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.