MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-2: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR 1,50 MM, 1,27 MM AND 1,00 MM PITCH BALL AND COLUMN TERMINAL PACKAGES
International Electrotechnical Committee
FOREWORD<br>INTRODUCTION<br>1 Scope<br>2 Normative references<br>3 Definitions<br>4 Ball terminal packages, 1.50 mm and 1.00 mm pitch<br>5 Column terminal packages, 1.50 mm, 1.27 mm and <br> 1.00 mm pitch
Covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball and column terminal packages e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA).
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 47 |
