SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
International Electrotechnical Committee
FOREWORD
INTRODUCTION
1 Scope and object
1.1 Scope
1.2 Object
2 Normative references
3 Terms and definitions
4 Requirements for component design and component
specifications
4.1 General requirement
4.2 Packaging
4.3 Labelling of product packaging
4.4 Component marking
4.5 Storage and transportation
4.6 Component outline and design
4.7 Mechanical stress
4.8 Component reliability assurance
4.9 Additional requirements for compatibility with
lead-free soldering
5 Specification of assembly process conditions
5.1 General
5.2 Securing the component on the substrate prior
to soldering
5.3 Mounting methods
5.4 Cleaning (where applicable)
5.5 Removal and/or replacement of SMDs
6 Typical process conditions
6.1 Soldering processes, temperature/time profiles
6.2 Typical cleaning conditions for assemblies
7 Requirements for components and component specifications
related to suitability with various mounting processes
7.1 General
7.2 Wettability
7.3 Resistance to dissolution of metallization
7.4 Resistance to soldering heat
7.5 Resistance to cleaning solvent
7.6 Soldering profiles
7.7 Bonding strength test for the component glue interface
test
Bibliography
Provides a reference set of process conditions and related test conditions to be used when compiling component specifications of electronic components that are intended for usage in surface mount technology.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 91 |
