MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES
International Electrotechnical Committee
FOREWORD<br>1 Scope<br>2 Normative references<br>3 Terms and definitions<br>4 Design rules<br>5 Dimensions to be specified<br>6 Notes<br>Annex A (informative) - Illustration of the rules<br>Annex B (informative) - Optional table format<br>Bibliography
Provides general rules for the preparation of outline drawings of surface-mounted semiconductor devices. It also covers all surface-mounted devices discrete semiconductors with lead count of greater or equal to 8, as well as integrated circuits classified as form E in Clause 3 of IEC 60191-4.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 47 |
