CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 6-2: DYNAMIC STRESS TESTS - TEST 6B: BUMP
International Electrotechnical Committee
Foreword
1 General
2 Preparation of the specimen
3 Test method
4 Measurements
5 Details to be specified
Aims to define a standard test method to assess the ability of components to withstand specified severities of bump.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 48 |
