IEC 61967-1 : 1.0

INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - PART 1: GENERAL CONDITIONS AND DEFINITIONS

International Electrotechnical Committee

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FOREWORD
1 Scope
2 Normative references
3 Definitions
4 Test conditions
   4.1 General
   4.2 Ambient conditions
        4.2.1 Ambient temperature
        4.2.2 Ambient RF field strength
        4.2.3 Other ambient conditions
        4.2.4 IC stability over time
5 Test equipment
   5.1 General
   5.2 Shielding
   5.3 RF measuring instrument
        5.3.1 Measuring receiver
        5.3.2 Spectrum analyzer
        5.3.3 Other RBW for narrowband disturbances
        5.3.4 Disturbance type, detector type and sweep
              speed
        5.3.5 Video bandwidth
        5.3.6 Verification of calibration for the RF
              measuring instrument
   5.4 Frequency range
   5.5 Pre-amplifier or attenuator
   5.6 System gain
   5.7 Other components
6 Test set-up
   6.1 General
   6.2 Test circuit board
   6.3 IC pin loading
   6.4 Power supply requirements - Test board power supply
   6.5 IC specific considerations
        6.5.1 IC supply voltage
        6.5.2 IC decoupling
        6.5.3 Activity of IC
        6.5.4 Guidelines regarding IC operation
7 Test procedure
   7.1 Ambient check
   7.2 Operational check
   7.3 Specific procedures
8 Test report
   8.1 General
   8.2 Ambient
   8.3 Description of device
   8.4 Description of set-up
   8.5 Description of software
   8.6 Data presentation
        8.6.1 Graphical presentation
        8.6.2 Software for data capture
        8.6.3 Data processing
   8.7 RF emission limits
   8.8 Interpretation of results
        8.8.1 Comparison between IC(s) using the same
              test method
        8.8.2 Comparison between different test methods
        8.8.3 Correlation to module test methods
9 General basic test board specification
   9.1 Board description - mechanical
   9.2 Board description - electrical characteristics
   9.3 Ground planes
   9.4 Pins
        9.4.1 DIL packages
        9.4.2 SOP, PLCC, QFP packages
        9.4.3 PGA, BGA packages
   9.5 Via type
   9.6 Via distance
   9.7 Additional components
        9.7.1 Supply decoupling
        9.7.2 I/O load
Annex A (informative) Test method comparison
Annex B (informative) Flow chart of an example counter
        test code
Annex C (informative) Prescription of a worst-case
        application software description
Bibliography
Figures

Abstract

Gives general information and definitions on measurement of conducted and radiated electromagnetic disturbances from integrated circuits. Also provides a description of measurement conditions, test equipment and set-up as well as the test procedures and content of the test reports.