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IEC 61190-1-3 : 3.0

IEC 61190-1-3 : 3.0

ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS

International Electrotechnical Committee

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Table of Contents

FOREWORD<br>INTRODUCTION<br>1 Scope <br>2 Normative references <br>3 Terms and definitions <br>4 Classification<br>5 Requirements <br>6 Quality assurance provisions<br>7 Preparation for delivery - Preservation,<br>&nbsp;&nbsp;packing and packaging <br>Annex A (informative) - Selection of various<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;alloys and fluxes for use in electronic<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;soldering - General information concerning<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;IEC 61190-1-3<br>Annex B (normative) - Lead-free solder alloys <br>Annex C (informative) - Marking method of solder<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;designation for mounted board, used<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;in electronic equipment <br>Bibliography

Abstract

Describes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for 'special' electronic grade solders.

General Product Information

Document Type Standard
Status Current
Publisher International Electrotechnical Committee
Committee TC 91

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