IEC 60749-9 : 2.0
IEC 60749-9 : 2.0
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 9: PERMANENCE OF MARKING
International Electrotechnical Committee
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 9: PERMANENCE OF MARKING
International Electrotechnical Committee
FOREWORD<br>1 Scope<br>2 Normative references<br>3 Terms and definitions<br>4 Equipment<br>5 Safety precautions<br>6 Procedure<br>7 Failure criteria<br>8 Summary<br>Bibliography
Aims to determine whether the marks on solid state semiconductor devices will remain legible when subjected to the application and removal of labels or the use of solvents and cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board manufacturing process.
Document Type | Standard |
Status | Current |
Publisher | International Electrotechnical Committee |
Committee | TC 47 |
Supersedes |
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