SEMICONDUCTOR DEVICES - INTEGRATED CIRCUITS - PART 23-3: HYBRID INTEGRATED CIRCUITS AND FILM STRUCTURES - MANUFACTURING LINE CERTIFICATION - MANUFACTURERS' SELF-AUDIT CHECKLIST AND REPORT
International Electrotechnical Committee
FOREWORD
INTRODUCTION
1 Scope
2 Document information
2.1 General
2.2 Normative references
3 Definitions
4 General requirements
4.1 Self-audit checklist and report for thick and
thin film hybrid integrated circuit manufacturers
4.2 Description of report/company structure
4.3 Approval information
4.4 Summary of testing
4.5 Analytical methods
4.6 Control of procurement sources and incoming material
4.7 Control of procurement sources and incoming material,
continued
4.8 Environmental control and static handling
4.9 Change notification requirements
4.10 Hybrid design
5 Thick film processing
5.1 Artwork and screen fabrication
5.2 Substrates
5.3 Substrate saw or scribe and break and substrate hole
drilling
5.4 Thick film pastes and printing
5.5 Drying and firing
5.6 Resistor trimming
5.7 Inspection and test of processing
5.8 Rework
6 Thin film processing
6.1 Artwork and mask fabrication
6.2 Substrates
6.3 Substrate saw or scribe and break and substrate hole
drilling
6.4 Thin film processing materials and pattern forming
6.5 Drying and stabilization
6.6 Resistor trimming
6.7 Rework
7 Hybrid assembly
7.1 Solder assembly
7.2 Chip and wire assembly
8 Test and dispatch
8.1 Electrical tests
8.2 Burn-in
8.3 Endurance
8.4 Dry heat (stabilization bake)
8.5 Change of temperature
8.6 Damp heat testing
8.7 Particle impact noise detection.
8.8 Fine leak test
8.9 Gross leak test
8.10 Resistance to soldering heat
8.11 Termination robustness
8.12 Acceleration
8.13 Vibration
8.14 Shock
8.15 Dimensions
8.16 Bond-pull testing
8.17 Salt mist
8.18 Flammability
8.19 Solderability
8.20 Resistance to solvents
8.21 Internal visual inspection
8.22 External visual inspection
8.23 Radiographic inspection
8.24 Acceptance to dispatch
Applicable to a high quality approval system for hybrid integrated circuits and film structures. This checklist is intended for the use of a hybrid microcircuit manufacturer's internal assessment team.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 47 |
| Supersedes |
|
