IEC 60748-23-2 : 1.0

Table of Contents

FOREWORD<br>INTRODUCTION<br>1 Scope<br>2 Normative references<br>3 Definitions<br>4 Apparatus<br>5 Procedure<br>&nbsp;&nbsp;&nbsp;5.1 General<br>&nbsp;&nbsp;&nbsp;5.2 Sequence of inspection<br>&nbsp;&nbsp;&nbsp;5.3 Inspection control<br>&nbsp;&nbsp;&nbsp;5.4 Re-inspection<br>&nbsp;&nbsp;&nbsp;5.5 Exclusions<br>&nbsp;&nbsp;&nbsp;5.6 Magnification<br>&nbsp;&nbsp;&nbsp;5.7 Format and conventions<br>&nbsp;&nbsp;&nbsp;5.8 Interpretations<br>6 Thin film element inspection<br>&nbsp;&nbsp;&nbsp;6.1 Operating metallization non-conformances - 'high <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;magnification'<br>&nbsp;&nbsp;&nbsp;6.2 Passivation non-conformances 'high magnification'<br>&nbsp;&nbsp;&nbsp;6.3 Glassivation non-conformances, 'high magnification'<br>&nbsp;&nbsp;&nbsp;6.4 Substrate non-conformances 'high magnification'<br>&nbsp;&nbsp;&nbsp;6.5 Foreign material non-conformances 'low magnification'<br>&nbsp;&nbsp;&nbsp;6.6 Thin film resistor non-conformances, 'high <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;magnification'<br>&nbsp;&nbsp;&nbsp;6.7 Laser trimmed thin film resistor non-conformances, <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;'high magnification'<br>&nbsp;&nbsp;&nbsp;6.8 Multilevel thin film non-conformances, 'high <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;magnification'<br>&nbsp;&nbsp;&nbsp;6.9 Coupling (air) bridge non-conformances 'high <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;magnification'<br>7 Planar thick film element inspection<br>&nbsp;&nbsp;&nbsp;7.1 Operating metallization non-conformances 'low <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;magnification'<br>&nbsp;&nbsp;&nbsp;7.2 Substrate non-conformances, 'low magnification'<br>&nbsp;&nbsp;&nbsp;7.3 Thick film resistor non-conformances, 'low <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;magnification'<br>&nbsp;&nbsp;&nbsp;7.4 Trimmed thick film resistor non-conformances, 'low <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;magnification'<br>&nbsp;&nbsp;&nbsp;7.5 Multilevel thick film non-conformances, 'low <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;magnification'<br>&nbsp;&nbsp;&nbsp;7.6 All thin film capacitors and overlay capacitors used <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;in GaAs microwave devices, 'low magnification'<br>8 Active and passive elements<br>9 Element attachment (assembly), 'magnification 10x to 60x'<br>&nbsp;&nbsp;&nbsp;9.1 Solder connections (general appearance)<br>&nbsp;&nbsp;&nbsp;9.2 Element attachment requirements<br>&nbsp;&nbsp;&nbsp;9.3 Leaded and leadless element attachment<br>&nbsp;&nbsp;&nbsp;9.4 Dual-in-line integrated circuit attachment (butt joints)<br>&nbsp;&nbsp;&nbsp;9.5 Axial and radial leaded components (lap joints)<br>&nbsp;&nbsp;&nbsp;9.6 Components with feet (combined butt and lap joints)<br>&nbsp;&nbsp;&nbsp;9.7 Leadless chip carriers<br>10 Element orientation<br>11 Separation<br>12 Bond inspection, magnification 30x to 60x<br>&nbsp;&nbsp;&nbsp;12.1 Ball bonds <br>&nbsp;&nbsp;&nbsp;12.2 Wire wedge bonds<br>&nbsp;&nbsp;&nbsp;12.3 Tailless bonds (crescent)<br>&nbsp;&nbsp;&nbsp;12.4 Compound bond<br>&nbsp;&nbsp;&nbsp;12.5 Beam lead<br>&nbsp;&nbsp;&nbsp;12.6 Mesh bonding<br>&nbsp;&nbsp;&nbsp;12.7 Ribbon bonds<br>&nbsp;&nbsp;&nbsp;12.8 General<br>13 Internal leads (e.g. wires, ribbons, beams, wire loops, <br>&nbsp;&nbsp;&nbsp;ribbon loops, beams, etc.), 'magnification 10x to 60x'<br>14 Screw tabs and through-hole mounting, magnification 3x <br>&nbsp;&nbsp;&nbsp;to 10x<br>15 Connector and feedthrough centre contact soldering, <br>&nbsp;&nbsp;&nbsp;magnification 10x to 30x<br>16 Package conditions, solder assemblies, lead frame <br>&nbsp;&nbsp;&nbsp;attachments, conformal coating, 'magnification 10x to 60x'<br>&nbsp;&nbsp;&nbsp;16.1 Package conditions<br>&nbsp;&nbsp;&nbsp;16.2 Lead frame attachment<br>&nbsp;&nbsp;&nbsp;16.3 Conformal coating<br>17 Non-planar element inspection<br>&nbsp;&nbsp;&nbsp;17.1 General non-planar element non-conformances, 'low <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;magnification'<br>&nbsp;&nbsp;&nbsp;17.2 Foreign material non-conformances 'low magnification'<br>&nbsp;&nbsp;&nbsp;17.3 Ceramic chip capacitor non-conformances 'low <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;magnification'<br>&nbsp;&nbsp;&nbsp;17.4 Tantalum chip capacitor non-conformances, 'low <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;magnification'<br>&nbsp;&nbsp;&nbsp;17.5 Parallel plate chip capacitor non-conformances, 'low <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;magnification'<br>&nbsp;&nbsp;&nbsp;17.6 Inductor and transformer non-conformances, 'low <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;magnification'<br>&nbsp;&nbsp;&nbsp;17.7 Chip resistor non-conformances, 'low magnification'<br>18 Surface acoustic wave (SAW) element inspection<br>&nbsp;&nbsp;&nbsp;18.1 Operating metallization non-conformances 'low <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;magnification'<br>&nbsp;&nbsp;&nbsp;18.2 Substrate material non-conformances 'low magnification'<br>&nbsp;&nbsp;&nbsp;18.3 Foreign material non-conformances 'low magnification'<br>19 Summary<br>20 Radiographic inspection<br>&nbsp;&nbsp;&nbsp;20.1 Requirements<br>21 Particle impact noise detection (PIND) test<br>&nbsp;&nbsp;&nbsp;21.1 General<br>&nbsp;&nbsp;&nbsp;21.2 Equipment<br>&nbsp;&nbsp;&nbsp;21.3 Test procedure<br>&nbsp;&nbsp;&nbsp;21.4 Failure criteria<br>&nbsp;&nbsp;&nbsp;21.5 Lot acceptance<br>&nbsp;&nbsp;&nbsp;21.6 The detail specification<br>Figures<br>Table 1

Abstract

Applicable to high quality approval systems for hybrid integrated circuits and film structures. The purpose of the tests is to perform visual inspections on the internal materials, construction and workmanship of hybrid, multichip and multichip module microcircuits and passive elements used for microelectronic applications including r.f./microwave.

General Product Information

Published
Document Type	Standard
Status	Current
Publisher	International Electrotechnical Committee
Pages
ISBN
Committee	TC 47
Supersedes	IEC 60148B : 1979