INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - PART 6: MEASUREMENT OF CONDUCTED EMISSIONS - MAGNETIC PROBE METHOD
International Electrotechnical Committee
FOREWORD
1 Scope
2 Normative references
3 Definitions
4 General
4.1 Measurement philosophy
4.2 Measurement principle
5 Test conditions
5.1 General
5.2 Frequency range
6 Test equipment
6.1 General
6.2 Magnetic probe
6.3 Probe spacing fixture and placement
7 Test set-up
7.1 General
7.2 Probe calibration
7.3 Modifications to standardized IC test board
7.3.1 Layer arrangement
7.3.2 Layer thickness
7.3.3 Decoupling capacitors
7.3.4 I/O pin loading
8 Test procedure
8.1 General
8.2 Test technique
9 Test report
9.1 General
9.2 Documentation
Annex A (normative) Probe calibration procedure - Microstrip
line method
Annex B (informative) Measurement principle and calibration
factor
Annex C (informative) Spatial resolution of magnetic probe
Annex D (informative) Angle pattern of probe placement
Annex E (informative) Advanced magnetic probe
Bibliography
Specifies a method for evaluating RF currents on the pins of an integrated circuit (IC) by means of non-contact current measurement using a miniature magnetic probe.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 47 |
