SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC-ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
International Electrotechnical Committee
FOREWORD
1 Scope
2 Normative references
3 General description
4 Test apparatus and materials
4.1 Humidity chamber
4.2 Reflow soldering apparatus
4.3 Holder
4.4 Wave-soldering apparatus
4.5 Solvent for vapour-phase reflow soldering
4.6 Flux
4.7 Solder
5 Procedure
5.1 Initial measurements
5.1.1 Visual inspection
5.1.2 Electrical measurement
5.1.3 Internal inspection by acoustic tomography
5.2 Drying
5.3 Moisture soak
5.3.1 General
5.3.2 Conditions for non-dry-packed SMDs
5.3.3 Moisture soak for dry-packed SMDs
5.4 Soldering heat
5.4.1 General
5.4.2 Method of heating by infrared convection or
convection reflow soldering
5.4.3 Method of heating by vapour-phase reflow soldering
5.4.4 Method of heating by wave-soldering
5.5 Recovery
5.6 Final measurements
5.6.1 Visual inspection
5.6.2 Electrical measurement
5.6.3 Internal inspection by acoustic tomography
6 Information to be given in the relevant specification
Annex A (informative) Details and descriptions of test method
on resistance of plastic encapsulated SMDs
to the combined effect of moisture and
soldering heat
Describes a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs).
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 47 |
