IEC 61192-4 : 1.0
IEC 61192-4 : 1.0
WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 4: TERMINAL ASSEMBLIES
International Electrotechnical Committee
Specials
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AS/NZS 60335.2.2:2010 (IEC TEXT)
$78.00 (-56%) $34.32
Table of Contents
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
4.1 Classification
4.2 Conflict
4.3 Inspection technique
4.4 Interpretation of requirements
5 Process characterization
5.1 Wire preparation processes
5.2 Terminal mounting processes
5.3 Soldering terminal
5.4 Solderability
5.5 Preconditioning
5.6 Mechanical securing
6 Wire preparation attributes
6.1 Insulation stripping
6.2 Twisted strands
7 Connector pins and terminals
7.1 Soldered connector pins
8 Discrete wiring (jumper wires)
8.1 Wire selection
8.2 Wire routing
8.3 Staking
8.4 Termination
9 Discrete wiring (jumper wires) attributes
10 Solder joint acceptance
10.1 Post terminations
Figures
Table
Abstract
Defines general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally terminals or mixed assemblies that include surface-mounting or other related assembly technologies, for example through-hole, wires.
General Product Information
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 91 |
