IEC 61192-3 : 1.0

Table of Contents

FOREWORD<br>INTRODUCTION<br>1 Scope<br>2 Normative references<br>3 Terms and definitions<br>4 General requirements<br>&nbsp;&nbsp;&nbsp;4.1 Classification<br>&nbsp;&nbsp;&nbsp;4.2 Conflict<br>&nbsp;&nbsp;&nbsp;4.3 Inspection techniques<br>&nbsp;&nbsp;&nbsp;4.4 Interpretation of requirements<br>5 Component preparation processes<br>&nbsp;&nbsp;&nbsp;5.1 Lead forming<br>&nbsp;&nbsp;&nbsp;5.2 Lead protrusion and clinching<br>&nbsp;&nbsp;&nbsp;5.3 Lead cutting/cropping<br>&nbsp;&nbsp;&nbsp;5.4 Pre-tinning<br>6 Masking attributes<br>&nbsp;&nbsp;&nbsp;6.1 Misalignment<br>&nbsp;&nbsp;&nbsp;6.2 Improper adhesion<br>&nbsp;&nbsp;&nbsp;6.3 Thermal capability<br>7 Insertion of through-hole components<br>&nbsp;&nbsp;&nbsp;7.1 General requirements<br>&nbsp;&nbsp;&nbsp;7.2 Orientation and mounting criteria<br>&nbsp;&nbsp;&nbsp;7.3 Missing component<br>&nbsp;&nbsp;&nbsp;7.4 Wrong component<br>&nbsp;&nbsp;&nbsp;7.5 Damaged component<br>8 Soldering process attributes<br>&nbsp;&nbsp;&nbsp;8.1 General requirements<br>&nbsp;&nbsp;&nbsp;8.2 Misalignment<br>&nbsp;&nbsp;&nbsp;8.3 Damaged components<br>&nbsp;&nbsp;&nbsp;8.4 Solder joint characteristics<br>9 Cleaning attributes<br>&nbsp;&nbsp;&nbsp;9.1 Flux residues<br>&nbsp;&nbsp;&nbsp;9.2 Other residues<br>10 Rework/replacement attributes<br>Figures<br>Tables

Abstract

Defines general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates.

General Product Information

Published
Document Type	Standard
Status	Current
Publisher	International Electrotechnical Committee
Pages
ISBN
Committee	TC 91