SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 5: STEADY-STATE TEMPERATURE HUMIDITY BIAS LIFE TEST
International Electrotechnical Committee
FOREWORD<br>1 Scope <br>2 Normative references <br>3 Terms and definitions <br>4 General<br>5 Equipment<br>6 Test conditions <br>7 Procedures <br>8 Failure criteria<br>9 Safety <br>10 Summary
Gives a steady-state temperature and humidity bias life test for the purpose of evaluating the reliability of non-hermetic packaged solid-state devices in humid environments.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 47 |
| Supersedes |
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