SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 16: PARTICLE IMPACT NOISE DETECTION (PIND)
International Electrotechnical Committee
Foreword<br>1 Scope<br>2 Terms and definitions<br>3 General remarks<br>4 Equipment<br>5 Test procedure<br>6 Failure criteria<br>7 Lot acceptance (for guidance)<br>8 Detail specification<br>9 Summary<br>Bibliography
Detects the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 47 |
| Supersedes |
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