IEC 60749-19 : 1.1

Table of Contents

Foreword<br>1 Scope<br>2 Description of the test apparatus<br>3 Test method<br>4 Failure criteria<br>5 Requirements<br>6 Categories of separation<br>7 Summary

Abstract

Describes the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates (for the purpose of this test method, the term 'semiconductor die' should be taken to include passive elements).

General Product Information

Published
Document Type	Standard
Status	Current
Publisher	International Electrotechnical Committee
Pages
ISBN
Committee	TC 47