MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-4: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF BALL GRID ARRAY (BGA)
International Electrotechnical Committee
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Reference character and drawings
4.1 Ball grid array package (BGA) Type 1 - Ball datum
4.2 Ball grid array package (BGA) Type 2 - Body datum
5 Measuring method
5.1 Datum S as pertaining to ball coplanarity
5.2 Datum A, B
5.3 Definition of specified dimensions and measuring method
5.4 Profile of a package edge surface v
5.5 Mounting height A
5.6 First stand-off A1
5.7 Second stand-off A4
5.8 Ball diameter b
5.9 Ball centre position X
5.10 Ball coplanarity y
5.11 Package top flatness y1
Covers the requirements for the measuring methods of ball grid array (BGA) dimensions.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 47 |
