IEC 60749-29 : 2.0
IEC 60749-29 : 2.0
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 29: LATCH-UP TEST
International Electrotechnical Committee
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 29: LATCH-UP TEST
International Electrotechnical Committee
FOREWORD<br>1 Scope and object <br>2 Terms and definitions<br>3 Classification and levels<br>4 Apparatus and material <br>5 Procedure <br>6 Failure criteria <br>7 Summary <br>Annex A (informative) - Examples of special pins that are <br> connected to passive components <br>Annex B (informative) - Calculation of operating ambient <br> or operating case temperature for a given operating <br> junction temperature
Covers the I-test and the overvoltage latch-up testing of integrated circuits.
Document Type | Standard |
Status | Current |
Publisher | International Electrotechnical Committee |
Committee | TC 47 |
Supersedes |
|