IEC 60749-21 : 2.0
IEC 60749-21 : 2.0
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 21: SOLDERABILITY
International Electrotechnical Committee
Specials
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ASME NQA 1:1997
$78.00 (-56%) $34.32
Table of Contents
FOREWORD<br>1 Scope<br>2 Normative references<br>3 Test apparatus<br>4 Procedure <br>5 Summary <br>Bibliography
Abstract
Covers a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free (Pb-free) solder for the attachment.
General Product Information
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 47 |
| Supersedes |
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