SEMICONDUCTOR DEVICES - PART 16-10: TECHNOLOGY SCHEDULE (TAS) FOR MONOLITHIC MICROWAVE INTEGRATED CIRCUITS
International Electrotechnical Committee
FOREWORD
Foreword to this particular Technology Approval Schedule (TAS)
Organizations responsible for preparing the present TAS
Preface
INTRODUCTION
1 General
1.1 Scope
1.2 Normative documents
1.3 Units, symbols and terminology
1.4 Standard and preferred values
1.5 Definitions
2 Definition of the component technology
2.1 Scope
2.2 Description of activities and flow charts
2.3 Technical abstract
2.4 Requirements for control of subcontractors
3 Component design of MMICs
3.1 Scope
3.2 Description of activities and flow charts
3.3 Interfaces
3.4 Validations and control of the processes
4 Mask manufacture
4.1 Scope
4.2 Description of activities and flow charts
4.3 Validation and control of the processes
4.4 Subcontractors, vendors and internal suppliers
5 Wafer fabrication of MMICs
5.1 Scope
5.2 Description of activities and flow charts
5.3 Equipment
5.4 Materials
5.5 Re-work
5.6 Validation methods and control of the processes
5.7 Interrelationship
6 Wafer probing of MMICs
6.1 Scope
6.2 Description of activities and flow charts
6.3 Equipment
6.4 Test procedures
6.5 Interrelationship
7 Back-side process for bare chip delivery
7.1 Scope
7.2 Description of activity and flow charts
7.3 Equipment
7.4 Materials
7.5 Validation methods and control of the processes
7.6 Interrelationship
7.7 Validity of release
8 Assembly of MMICs
8.1 Scope
8.2 Description of activities and flow charts
8.3 Materials, inspection and handling
8.4 Equipment
8.5 Re-work
8.6 Validation and control of the processes
8.7 Interrelationships
9 Testing of MMICs
9.1 Scope
9.2 Description of activities and flow charts
9.3 Equipment
9.4 Test procedures
9.5 Interfaces
9.6 Validation and control of the processes
9.7 Process boundary verification
9.8 Product verification
10 Process characterization
10.1 Identification of process characteristics
10.2 Description of activities
10.3 Characterization procedures
11 Packaging and shipping
11.1 Description of activities and flow charts
11.2 Interfaces
11.3 Validity of release
12 Withdrawal of Technology Approval
Figures
Defines the terms, definitions, symbols, quality system, test, assessment and verification methods and other requirements relevant to the design, manufacture and supply of monolithic microwave integrated circuits in compliance with the general requirements of the IECQ-CECC System for electronic components of assessed quality.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 47 |
