IEC TR 62258-3 : 2.0

Table of Contents

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Handling - Good practice
5 Process handling issues
6 Die and wafer transport and storage media
7 Storage good practice
8 Traceability good practice
9 Guidelines for long-term storage (die banking) of
   bare die and wafers
10 Good practice for automated handling during
   assembly
Annex A (informative) - Planning checklist
Annex B (informative) - Material specifications
Bibliography

Abstract

Facilitates the production, supply and use of semiconductor die products, including: - wafers, - singulated bare die, - die and wafers with attached connection structures, and - minimally or partially encapsulated die and wafers.

General Product Information

Published
Document Type	Standard
Status	Current
Publisher	International Electrotechnical Committee
Pages
ISBN
Committee	TC 47