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IEC 60749-35 : 1.0

IEC 60749-35 : 1.0

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 35: ACOUSTIC MICROSCOPY FOR PLASTIC ENCAPSULATED ELECTRONIC COMPONENTS

International Electrotechnical Committee

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Table of Contents

FOREWORD<br>1 Scope<br>2 Terms and definitions<br>3 Test apparatus<br>&nbsp;&nbsp;3.1 Reflective acoustic microscope system<br>&nbsp;&nbsp;3.2 Through transmission acoustic microscope system<br>&nbsp;&nbsp;3.3 Reference packages or standards<br>&nbsp;&nbsp;3.4 Sample holder<br>4 Procedure<br>&nbsp;&nbsp;4.1 General<br>&nbsp;&nbsp;4.2 Equipment setup<br>&nbsp;&nbsp;4.3 Performance of acoustic scans<br>Annex A (informative) Acoustic microscopy check sheet<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;(example only - not a mandatory template)<br>Annex B (informative) Potential image pitfalls<br>Annex C (informative) Some limitations of acoustic microscopy<br>Annex D (informative) Reference checklist for presenting<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;applicable scanned data<br>Bibliography

Abstract

Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. It provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.

General Product Information

Document Type Standard
Status Current
Publisher International Electrotechnical Committee
Committee TC 47
Supersedes
  • IEC PAS 62191 : 1.0

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