IEC 62258-6 : 1.0
IEC 62258-6 : 1.0
SEMICONDUCTOR DIE PRODUCTS - PART 6: REQUIREMENTS FOR INFORMATION CONCERNING THERMAL SIMULATION
International Electrotechnical Committee
Specials
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IEC 60050-801 : 2.0
$78.00 (-56%) $34.32
Table of Contents
FOREWORD<br>INTRODUCTION<br>1 Scope<br>2 Normative references <br>3 Terms and definitions<br>4 General <br>5 Requirements for information for thermal simulation<br> 5.1 Requirements for bare die with or without added <br> connection structures<br> 5.2 Requirements for minimally-packaged die <br> 5.3 Information on thermal simulation model<br>Bibliography
Abstract
Determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die.
General Product Information
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 47 |
